10Month13Day,CanSemi (Stock Code301660)officially listed on the ChiNext board of the Shenzhen Stock Exchange. As one of the strategic placement investors in CanSemi's initial public offering, awinic participated in this issuance. Leveraging capital as a bond and industrial synergy as a driver, awinic is extending deeply into the critical upstream wafer manufacturing segment, making another key move in its industrial chain layout.
PART 01
I. Chip Strength | Locking in12-inch Advanced Process to Solidify the Leading Advantage in Domestic Mixed-Signal Chips
As a leadingenterprise in the domestic mixed-signal chip field, awinic has long focused on R&D and innovation of high-performance mixed-signal chips, continuously deepening its industrial chain layout around“design—, —manufacturing”, and packaging and testing12. Currently, the companyhas seized the opportunityCEOto layout “-inch advanced processes8, leading industry development. Mr. Lou Shengbo of the company stated in an interview:80%"Currently, domestic analog companies mainly focus on 12-inch processes, while awinic has shifted its”
capacity to BCD-inch, building a solid technological and cost moat for the company."90nmIn terms of process design, awinic continues to strengthen its technical barriers. The company consolidates its leading advantage in 55nm/40nm BCDprocess, with the AInode achieving large-scale mass production. The
process has entered the customer validation stage, while R&D on more advanced nodes is progressing steadily. Additionally, ultra-low-power processes have been upgraded to effectively empower the long-term battery life requirements of edge-side BCDproducts.Regarding collaborations with foundries, awinic maintains good cooperative relationships with global leading wafer suppliers such as TSMC, HHGrace, and SMIC, securing mature process capacity and continuously enhancing the autonomy and controllability of core processes. This strategic placement
investment in CanSemi“represents a deep upgrade based on existing foundry cooperation, further expanding and consolidating industrial synergy with domestic wafer manufacturers, and strengthening upstream supply chain and process accumulation.”On the packaging front, awinic collaborates with top packaging and testing foundries to expand fan-out and other packaging routes, developing high heat dissipation, high power, and AIlight, thin, and small9packaging solutions. Relying on a diversified product matrix, these efforts meet market demands for edge-side
and portable devices. In “this year, awinic participated in the private placement of TFME Microelectronics Co., Ltd., a leading enterprise in the semiconductor packaging and testing industry, which is an extension of the company's long-term layout in the advanced packaging field.”In the testing segment, awinic's Lingang "Ink Bottle"2026Automotive-Grade Experimental Testing Center6officially commenced operations in 9.4Year 11Month300. With a total investment exceeding 500billion yuan and a construction area surpassing
ten thousand square meters, it plans an annual chip testing scale of
PART 02
hundred million to “hundred million units, making it the largest automotive-grade chip testing center in China.”
Through deep synergy with upstream wafer manufacturers, collaboration with advanced packaging and testing partners, and the addition of self-built large-scale automotive testing capabilities, awinic is gradually connecting critical segments of the semiconductor industry chain to build a comprehensive collaborative capability system.
On one hand, the company's core business in analog chips, power management, and power-related fields aligns closely with Yuexin Semiconductor's specialty process platform, bringing it nearer to end applications and product definitions, thereby continuously refining requirements for chip performance, reliability, and cost across various scenarios; on the other hand, leveraging its own wafer manufacturing platform, Yuexin Semiconductor can translate downstream product demands into stable, mass-producible process capabilities, creating a mutually reinforcing relationship between the two parties.
As of20264, Yuexin Semiconductor is the only enterprise in mainland Chinapossessing12-inch silicon photonics wafer mass production capabilities. Both parties will establish an efficient R&D collaboration mechanism to conduct joint technical breakthroughs in frontier areas such as high-end analog chips and high-end mixed-signal chips.
Leveraging Yuexin Semiconductor's12-inch wafer specialty process platform, awinic will jointly refine process parameters and solutions adapted to harsh operating conditions with them. Collaborative efforts will span the entire chain from process architecture design and product performance iteration to mass production stability testing, working together to overcome technical challenges in low-power, high-integration chip technologies, and solidifying the core technical barriers for both parties in the industrial chains of consumer electronics, edge-sideAI, industrial interconnection, and automotive sectors.
PART 03
III. Chip Future | From Capital Cooperation to Ecosystem Co-construction, Embarking on China's Semiconductor“Chip”Journey
This strategic placement investment in Yuexin Semiconductor represents a significant practice by awinic to promote coordinated development within the industry chain.
For enterprises centered on chip design, establishing long-term partnerships with high-quality wafer manufacturers facilitates technical exchange and industrial synergy between upstream and downstream sectors. By investing in domestic wafer manufacturers, awinic further strengthens its connection to the semiconductor manufacturing segment, deepens ecosystem cooperation, and demonstrates its strategic direction of proactively layouting around core industry chain resources to consolidate long-term competitiveness.
Moving from capital synergy to ecosystem co-construction, the partnership between awinic and Yuexin Semiconductor is not merely an industrial investment, but a vivid practice of“mutual empowerment and collaborative win-win”between upstream and downstream sectors of the industry chain.
In the future, awinic will continue to uphold technological innovation, build upon its core advantages in analog chips, constantly improve its product matrix and industrial ecosystem, and seize development opportunities in emerging industries such as artificial intelligence and automotive electronics; meanwhile, it will continuously explore opportunities for industry chain synergy, looking forward to joining forces with more industry partners,using“chips”as a medium for collaborative innovation to jointly build the“chip”future of China's semiconductor industry.
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