Today's smartphones, wearables,TWScharging cases, low-powerIoTnodes, and portable detection devices always face a realistic contradiction: limited by body size, battery capacity is hard to increase, yet product functions continue to accumulate——. It is necessary to support sensors staying on standby and quick wake-up response, while ensuringstable output throughout the full cyclewithin the complete battery discharge range.
Conventional power solutions often sacrifice one aspect for another: either boost-only leads to high losses, wasting power pointlessly; or standby idle consumption is too large, quietly eating up the already limited battery capacity; or there are many peripheral components occupying a large board area, squeezing the already tight body space, becoming a major headache for many hardware developers.
Addressing these pain points, based on years of accumulation in mixed-signal design, awinic has launched a low-power buck-boost product matrix represented by AWP37701/2/3 , embedding power management performance into square-inch silicon chips. This year, it further launched the 3.5Aproduct 3μA series with an output current of AWP37703 and static power consumption of
1.Struggling with microamp-level power consumption to genuinely save battery life Buck-boost
The typical quiescent current of the low-power3μAseries chips is only0.3μA, with shutdown current as low asIoT, pressing invalid losses in standby state to an extremely low level. For wearables and1μA devices that spend most of their time in sleep mode and only wake up for short periods of operation, everyof standby current saved accumulates toextend battery life by several days or even weeks.
MeanwhilePFM/PWM, it supportsautomatic switching and manual controlPWM. It relies on low-power mode to save energy under light loads and switches toPWMto ensure stable output under heavy loads, maintaining high efficiency across the full load range and preventing power waste in useless idling. Alternatively, specific modes can be manually set to force, maintainingultra-low ripple across the full rangeandhigh transient response performance.25kHz This series synchronously integrates an ultrasonic mode, configurable to keep the chip's switching frequency above,avoiding additional noise caused by vibrations of onboard capacitors
2.AWP37703Wide voltage flexible adaptation, stable throughout the full battery cycle1.8V-5.5V
The input of the1.175V-5.5Vseries covers, and the output can be flexibly configured between, adapting to common power supply systems such as lithium batteries and dry cells.
Buck and boost states switch seamlessly and automatically1.2Vand1.8VofI2Cdigital interface, supportingdynamic voltage scaling and multi-level slew rate adjustment, capable of adapting to varying load requirements such as optical detection, motor driving, and sensor power supply, covering multiple application scenarios with a single solution.
3.High integration in a small package, simultaneously enhancing load capacity
AdoptingWLCSPcompact packaging with high integration, significantly reducing the number of peripheral components and saving valuablePCBPCB layout area. No need to stack discrete buck-boost solutions,a single chip can handle complete power supply, perfectly suited for space-constrained terminals like watches, fitness bands, earphone charging cases, and portable instruments, leaving more room for structural design and battery expansion.
Despite such a small package, the chip's load capacity ensures that at3Vinput and3.3Voutput, it can deliver at least3.5Acontinuous current, improving power density within the same footprint to power richer load modules and resolve energy insufficiency issues.
Furthermore, the chip incorporatescomprehensive protection mechanisms against over-voltage, over-temperature, and short circuits, ensuring stability even under complex operating conditions, maintaining reliable long-term operation, and providing sustained and dependable power assurance for devices.
Some say low power consumption is a“slow craft”, not as immediately striking as flagship performance. This precisely echoes the perseverance of Pavel:True value never lies solely in moments of peak brilliance, but is hidden within countless inconsequential daily routines——It is every bit of current control during device sleep, every stable response during load transients, and every instance of reliable duty throughout years of operation. There are no shortcuts behind this; it relies entirely on the R&D team refining circuit designs round after round, discussing layout arrangements time and again, repeatedly calibrating within microamp figures, and continuously optimizing across square millimeter layouts. Dedicating every fraction of power to the user's core functions and yielding every inch of space to the product's structural design is the most straightforward fulfillment of faith by awinic technologists.
The "Book of the Later Han" states:“Though a trickle is scant, it gradually forms rivers; though a torch is tiny, it eventually sets the wild ablaze.”
Every microwatt-level power optimization and every compact package solution implementation may seem like minor details, but accumulated over time, they converge into solid steps forward for domestic power chips. In the future, awinic will continue to root itself in mixed-signal technology, deepening and solidifying products featuring low power consumption, high efficiency, high reliability, and miniaturization, providing long-term stable power supply solutions for more terminal devices.
Quick Overview of Core Product Highlights
Ultra-low quiescentIQ:3μA typical value, shutdown current 0.3μA, significantly extending battery terminal endurance
Wide-range buck-boost:1.8V-5.5V input, seamless automatic buck-boost switching, adapting to various battery types
Wide output range:1.175V-5.5V output, adapting to various load requirements with flexible configuration
Flexible controllability: Compatible with 1.2V and 1.8V GPIO,I2Cinterface supports dynamic voltage adjustment and slew rate regulation
Comprehensive protection:OVP/OTP/short-circuit protection, stable operation under complex conditions
Miniaturized packaging:WLCSP 2.287mm × 1.387mm - 15B
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