【New Product Launch】AI PC Fast Charging Protection Takes Another Leap Forward! AWINIC Launches Type C OVP Series Products

2026-07-04

As AI PC computing power continues to surge and performance is fully unleashed, device power consumption and recharging demands have increased significantly. High-power fast charging has become an irreversible industry trend. Traditional fast charging specifications below 100W can no longer meet the usage needs of high-performance AI terminals. PC fast charging power has officially entered a phased upgrade path, forming a 65W → 100W → 140W → 180W → 240W progression, fully covering the high-power power-supply scenarios of AI PCs, high-performance ultrabooks, gaming laptops, and multi-function docking stations.

AWINIC Type‑C OVP Series Products

The technological driver behind this power upgrade stems from the continuous iteration of the USB PD protocol. Charging voltage has also undergone a critical specification leap, advancing from 20V (SPR) → 28V (EPR) → 36V (EPR) → 48V (EPR). Among these, the PD3.1 SPR 20V specification suits 65W‑100W conventional fast‑charging scenarios, while the new PD3.2 EPR 28V/36V/48V high‑voltage specifications help devices break through power bottlenecks, supporting 140W‑240W and above ultra‑high‑power fast charging, greatly improving charging efficiency and overall system power supply stability. In response to this industry upgrade trend, AWINIC has launched a series of fast‑charging protection products that meet SPR 20V and EPR 28V charging voltage requirements, cover 140W‑180W charging power applications, and precisely align with the design needs of next‑generation AI PC fast‑charging systems.

Leveraging its core advantages of universality, high speed, and high integration, the Type‑C interface has become the standard port for AI PCs and docking stations, with multiple Type‑C ports operating in parallel being a mainstream hardware design. The new operating conditions of 28V high voltage + high power + multi‑port concurrent operation have dramatically increased the protection pressure on the device power supply system. Traditional simplistic protection schemes can no longer adapt to the demanding high‑voltage fast‑charging environment. The industry now demands high‑robustness design standards for systematic safety protection of Type‑C interfaces.

To ensure the long‑term safe and stable operation of AI PCs and docking stations under high‑voltage, high‑power fast‑charging scenarios, hardware designs must be equipped with four core protection capabilities, building a comprehensive power‑safety defense line:

I. Adapt to Multi‑C‑Port Application Scenarios

Adopt a back‑to‑back structure OVP protection that is compatible with multi‑port parallel charge/discharge operating conditions.

II. Equip Fast Over‑Voltage Protection

Combine strong surge protection and ESD protection capabilities to provide high‑robustness safety protection for the Type‑C input stage and downstream circuits, guarding against various high‑voltage anomalies and electrical disturbances.

III. Integrate Reverse‑Current Blocking Protection

Effectively prevent current backflow, avoiding damage to the chip and the overall system.

IV. Include Short‑Circuit Protection as Standard

Quickly handle faults such as plug/unplug anomalies and line short circuits, comprehensively covering all safety hazards in high‑power fast charging.

Product Advantages

1. Fast Over‑Voltage Protection

AWINIC AWP3210x Product

With external TVS SP1224, VIN = 20V, VIN surge = 100V, Rload = 100Ω, CIN/COUT = NC

Figure 1 AWINIC Solution OVP Response Time

OVP response time: 27ns, VIN max = 26.28V, VOUT max = 22.81V

Other Industry Solutions

With external TVS SP1224, VIN = 20V, VIN surge = 100V, Rload = 100Ω, CIN/COUT = NC

Figure 2 Other Industry Solution OVP Response Time

OVP response time: >1μs, VIN max = 28.5V, VOUT max = 27.6V

2. Dual Protection Advantages: Ideal Diode + Fast RCP

This is not merely a superposition of two functions, but a precise solution to a core pair of contradictions in OVP protection product design: efficient power delivery under normal conditions versus self‑preservation under catastrophic faults. The two independent mechanisms cover two completely different application scenarios.

Figure 3 AWINIC OVP Protection Scheme

Ideal Diode:

Addresses Slowly Varying Anomalies, Provides Efficient Normal‑State Anti‑Reverse‑Current Protection

When the adapter is unplugged or during voltage dips, the system‑side stored energy tends to backflow. In mild cases, this causes abnormal indications; in severe cases, it can damage the front‑end circuitry through reverse current. Traditional solutions rely on Schottky diodes, which generate severe heat under high current and pose thermal runaway risks at high temperatures.

Advantages:

Real‑time closed‑loop regulation of MOSFET gate voltage maintains an extremely low and stable forward voltage drop. Performance does not degrade under high‑temperature full‑load conditions, eliminating thermal runaway in principle and achieving efficient, smooth, seamless switching.

Fast RCP:

Addresses Extreme Short Circuits with Nanosecond‑Level Ultra‑Fast Hardware Protection

When VBUS is shorted to ground, the current surges with an extremely high di/dt. If relying only on microsecond‑level turn‑off protection (Ideal Diode response time), the reverse surge can instantly reach tens to hundreds of amperes—enough to melt bonding wires, destroy MOSFETs, burn PCB traces, and even cause complete system failure.

Advantages:

Senses and instantly cuts off the reverse path at nanosecond speeds, completely blocking energy before a destructive impact forms, providing the final safety barrier for both the chip itself and the overall system.

The Ideal Diode handles routine efficient power delivery and smooth transitions, while Fast RCP ensures survival under extreme fault conditions. The two are layered and complementary, forming a complete protection closed loop from normal operation to catastrophic scenarios.

3. Input and Output Surge Protection Mechanism Enhanced by AWINIC’s Patented Technology

The chip integrates built‑in surge protection, using an internal Q3 to equivalently replace the external TVS. A single component protects against surges on both the VIN and VOUT terminals, saving components, saving board area, and enabling a more streamlined design.