5G and AI technology blowout development, equipment computing power demand surge, traditional graphene, VC(Vapor Chamber) and other passive heat dissipation has been difficult to match high power heating. Liquid-cooled heat dissipation drive by virtue of active temperature control strong rise, through the coolant circulation to take away heat, heat dissipation efficiency than the passive solution to improve more than 3 times,Can accurately deal with the core area of the chip cooling pain point, is becoming the mainstream choice of high-end electronic equipment cooling program upgrade.
Recently, AI Electronics launched a new domestic liquid-cooled drive AW86320Piezoelectric Actuator[New Product Release] "Static Boundary Ice Core"-Ai Weitai Launches Piezoelectric Micropump Liquid Cooling and Heat Dissipation Drive SchemeIt can provide a driving voltage of more than 180Vpp, providing sufficient power for controlling liquid cooling and heat dissipation. It is worth mentioning that AW86320 adopts a brand-new buck-boost conversion circuit, which greatly simplifies the peripheral circuit and consumes the same power as overseas Top1 friends, bringing great convenience to the mass production application of miniaturized electronic equipment.
Advantages of liquid cooling
Efficient heat dissipation, precise temperature control
The micro-pump actively drives the coolant (such as water or special thermal fluid) to circulate in the pipeline, and the heat dissipation area covers the entire equipment back cover from point to surface. Compared with passive heat dissipation (such as graphene and heat sink), the heat dissipation efficiency is improved by 300, which can quickly take away the heat of core components such as CPU and battery, and the temperature can be reduced by 10-15 ℃ in high load scenarios,Avoid frequency reduction of equipment due to overheating.
Strong dynamic adjustment ability: AW86320 combines temperature control adaptive algorithm to control pump speed, and adjusts heat dissipation intensity in real time, taking into account energy efficiency and temperature control requirements.
Thin and light integration, bending resistance, high adaptability
The micro pump body is small in size (usually only a few cubic centimeters), and the pipeline design can fit the curved surface or folding structure of mobile phones, tablets and other equipment. The thickness increase is only 0.8-1.5mm, which does not affect the portability of the equipment, and is especially suitable for ultra-thin models or folding screen equipment sensitive to the thickness of the body.
Low noise energy saving, long-term stability
The operating noise of the micropump is less than 25 decibels (close to the noise level of the quiet environment of the library), and it will not produce obvious noise even under high load, which is better than the traditional fan cooling scheme. The overall power consumption is below 100MW, effectively balancing heat dissipation and power consumption.
Figure 1 Typical application scenario
Physical plug-in, mobile phone heat dissipation back shell
The size of the mobile phone cloth board is very small. Not all mobile phones have space to integrate the liquid cooling drive system into the fuselage. In order to achieve the ultimate heat dissipation performance, the liquid-cooled heat dissipation mobile phone case should be born. The heat dissipation system of the rear shell of the mobile phone includes wireless reverse charging coil + RX IC (power supply) + AW86320 (driving IC)+ liquid cooling heat dissipation components.
Figure 2 Mobile phone back cover liquid cooling system
Folding Machine Application
Folding machine due to the folding structure of the body is compact, heat dissipation space compression, screen, Hinge and motherboard and other multi-layer stacking easy heat accumulation. When the load is high, the heat source is concentrated, the heat dissipation path is long, the traditional scheme is inefficient, the folding screen power consumption is high, the heat is difficult to export, often local overheating, frequency reduction card. The liquid cooling scheme can quickly circulate the local heat source to the entire back cover of the mobile phone through the flow of coolant,Make the Heat drop quickly. And its bending characteristics perfectly solve the rigid VC in bending will fracture characteristics.
Figure 3 Folding mobile phone liquid cooling system
AW86320 Solution Advantages
Extreme peripheral circuit, ultra-small cloth board space
AW86320 is packaged in WLCSP with a size of 2.2mm x 1.8mm-20B, and afinic adopts a unique boost architecture, which reduces the use of input current sampling resistors and some capacitors compared with the friendly supplier scheme, thus greatly reducing the board area.
Fig.4 Typical application diagram of AW86320 For liquid cooling
Wide voltage input, high voltage output
AW86320 uses 2.5~5.5V low-voltage power supply, so it can adapt to a variety of common power supply environments. At the same time, it can output high-voltage sine waves up to 180vpk-PK, and its strong output capability is sufficient to drive various high-pressure liquid cooling pumps to meet the needs of different liquid cooling systems.
Simple and easy-to-use control operation
AW86320CSR fully considers the convenience of operation in the design of digital logic, and its control operation is simple and intuitive, without complicated programming or debugging experience. For example, only need to enter the required sine wave amplitude, frequency and other basic parameters, you can start the chip output required waveform. Novice users can also easily realize the control of liquid cooling pump,This greatly reduces the use of the threshold.
Low noise
MMC = 200Hz, 180 vpk-pk, H2O + N<<1% @ VBat = 3.6V for 40nf load
Sine wave of chip outputthd-total harmonic distortionIt is far less than 1%, which ensures the smooth operation of the liquid cooling pump and effectively reduces the noise generated during operation. Whether it is in a quiet office environment or a quiet night to use electronic digital products, will not be disturbed by the noise of the liquid cooling pump, to provide users with a quiet and comfortable experience.
low-power dissipatio
The standby current is only 6 μA @ Vbat = 3.6V, which greatly reduces the energy consumption of the device in the standby state and prolongs the battery life. In the working state, the power consumption under 10nf load is also far below 100 mW.
Expand application
AW86320 not only can be used for liquid cooling drive, and can be used in some piezoelectric tactile feedback, pressure sensing, capacitive lighting components and other applications to play its superior performance. Specific applications can contact Awinic official customer service.
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