Awinic Technology, a leading audio chip manufacturer, today officially launched the AW82101TSR, a high-performance digital audio amplifier chip. The AW82101TSR is specifically engineered for demanding scenarios such as AI toys, smart home appliances, and industrial applications. It tackles three major industry pain points: insufficient computing power in low-end main controllers, limited sound quality/loudness, and poor environmental reliability. By integrating the Feitian™ DSP, smart boost technology, and a high-reliability package, it provides a comprehensive end-to-end audio solution, delivering clearer, more powerful, and more stable and reliable audio performance for end products.
Main control platforms used in products like AI toys, smart home appliances, and industrial controls often suffer from insufficient audio computing power, making it difficult to integrate complex sound effects and protection algorithms. Consequently, most can only adopt a hardware solution consisting of a "simple amplifier + small speaker," failing to meet user demands for high-quality audio (such as rich bass, solid mid-range, and high instrument separation) and loud, clear sound for human-machine interaction experiences.
Awinic has innovatively integrated its proprietary SKTune® algorithms into the chip's built-in Feitian™ DSP, perfectly solving the industry challenge of low-end main control platforms being unable to run complex audio algorithms. While achieving high-quality sound and high-volume output, it creates a highly flexible, full-link audio solution integrating algorithms, amplification, and speaker protection.
Furthermore, smart home appliances, AI toys, and industrial equipment often face harsh environmental conditions. Applications like outdoor air conditioning units experience extreme temperature differences ranging from -40℃ to 125℃, kitchen appliances operate in persistently high temperatures, and complex environments involve humidity and dust. Traditional packaged chips are prone to issues like pin oxidation and solder joint detachment under these conditions, leading to device malfunctions, functional failure, shortened product lifespan, increased after-sales costs for manufacturers, and higher customer complaint rates.
The AW82101TSR utilizes a large-sized, high-reliability ETSSOP package, significantly enhancing soldering stability and environmental adaptability. It effectively addresses the aforementioned issues at the hardware level, ensuring long-term stability and reliability for products operating in complex conditions.
Product Specifications
Feitian™ DSP Inside with rich audio effects and protection algorithms:
MBDRC / 10-band EQ / Virtual Bass / Low Power Algorithm / Super Voice Mode
Low Temperature & Low Voltage Protection
Key Hardware Specifications:
6.0V Smart Boost with overall efficiency up to 87%
Output Power: 4.5W@4.2V (THD+N=10% @ 4Ω Load)
Low Noise: 10µV
THD+N: 0.02%
Supports Ultrasound Applications
Quiescent Current: 2.1mA
Input Interface & Power:
I²S/TDM Interface:
Standard I²S, Left-justified, Right-justified, supports 1~8 slot TDM format
Sampling Rate: 8kHz to 96kHz
I²C Interface: ≤1MHz
VDD: 3.0V - 5.5V
DVDD: 1.65V - 1.95V
VDDIO: 1.2V / 1.8V / 3.3V
Typical Application
Figure 1 Typical Application Diagram
Pin Definitions
Figure 2 Pin Definitions Diagram
Product Advantages
Awinic Feitian™ DSP Empowered with SKTune® Algorithms
Unleashing Main Control Computing Power
The AW82101TSR features a built-in Awinic Feitian™ DSP and is empowered with SKTune® algorithms. In addition to conventional multi-band DRC and 16-band EQ functions, it integrates Awinic's signature Virtual Bass and Dynamic EQ features to deliver richer, more captivating sound. For enhanced usability, a visual tuning solution via GUI allows for personalized algorithm adjustments, making operation simpler and more convenient.
Figure 3: AW82101TSR Integrates DSP with the Renowned awinicSKTune® Algorithm
SmartBoost Technology
The Boost converter type driver offers strong and stable driving capability.
After Boost activation, the quiescent current of the PA increases. A higher boost ratio leads to lower efficiency of the Boost circuit at low output power levels.
The Smart Boost architecture enhances efficiency and saves power consumption.
Figure 4: SmartBoost Efficiency
ETSSOP (Enhanced Thin Shrink Small Outline Package) with Wide Pin Pitch
Specifically engineered for demanding applications such as AI toys, industrial equipment, and smart home appliances:
· Enhanced Environmental Adaptability: The wide pin pitch design ensures superior reliability in harsh environments with high dust and humidity levels.
· Superior Audio Performance: The thin profile effectively reduces parasitic inductance and capacitance, perfectly matching the high-frequency switching characteristics of Class D amplifiers, minimizing distortion for clearer sound quality.
· Significantly Improved Heat Dissipation: Featuring an exposed thermal pad, it enables rapid heat transfer through the PCB copper layers, reducing chip temperature rise by over 30%.
Figure 5 Application Scenarios
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