Find packages

Here, you can look for suitable products according to package type, and you can contact our business personnel if they fail to find suitable package. We can help customers customize different products that can further improve cost-effectiveness in the process of miniaturization and performance improvement.

  • QFN

    Square flat no-extension pin package (back four-sided out pin)

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  • DFN

    Square flat no-extension pin package (back side two-out pin)

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  • WLCSP

    High pin count package for compact systems

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  • BGA

    High spherical pin number substrate package

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  • LGA

    High pin density solution in micro package

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  • FCQFN

    Flipchip Square flat no-extension pin package (back four-sided out pin)

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  • Other

    Other types of packaging

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